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Μηχανή SMT SPI
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High Precision 2D Laser Solder Paste Thicknes Inspection Machine

High Precision 2D Laser Solder Paste Thicknes Inspection Machine

Ονομασία μάρκας: HXT
Αριθμός μοντέλου: SH-110-2D
MOQ: 1
τιμή: 1200
Πληροφορίες συσκευασίας: Κιβώτιο Wodden
Όροι πληρωμής: T/T
Πληροφορίες λεπτομέρειας
Τόπος καταγωγής:
Κίνα
Πιστοποίηση:
CE
Ακρίβεια μέτρησης:
±0,001 mm (±1 µm)
Επαναλαμβανόμενη ακρίβεια:
±0,002 mm (±2 µm)
Διαστάσεις βάσης:
320 mm * 500 mm * 360 mm
Οπτική Μεγέθυνση:
25* – 110* (ρυθμιζόμενο σε 5 βήματα)
Ανάλυση εικόνας:
600 * 480 pixel
βάρος:
30 κιλά
Δυνατότητα προσφοράς:
1000 το μήνα
Περιγραφή προϊόντων
2D Solder Paste Thickness Inspection Machine
High Precision 2D Laser Solder Paste Thicknes Inspection Machine 0
Brief Introduction (Optimized for Buyers)

As Surface Mount Technology (SMT) advances, electronic components become increasingly smaller, packaging density becomes denser, and solder joints shrink correspondingly. Nearly 70% of PCB assembly defects are caused by improper solder paste printing.

The SH-110-2D Solder Paste Thickness Inspection Machine is designed to solve this problem. It effectively identifies potential defective solder deposits before component placement, provides accurate SPC control data (CPK, Cp), and significantly reduces defect rates.

In today's competitive electronic manufacturing environment, lower defect rates translate directly into higher profits. Strict process control requires factories to demonstrate their capability in managing solder paste printing during production. This machine provides that proof.

Beyond Solder Paste: The SH-110-2D can also be used in other production fields. Any geometric information of objects and components within 10 mm height can be precisely and non-contact measured.

Technological Parameters
Parameter Specification
Measurement Principle Non-contact laser triangulation
Measurement Accuracy ±0.001 mm (±1 µm)
Repeat Measurement Accuracy ±0.002 mm (±2 µm)
Base Dimensions (L*W*H) 320 mm * 500 mm * 360 mm
Platform Type Fixed marble platform (vibration-dampening)
Image System VGA high-definition camera
Optical Magnification 25* – 110* (5-step adjustable)
Measurement Light Source High-definition red laser
Illumination Adjustable annular LED (PC-controlled brightness)
Image Resolution 600 * 480 pixels
Software SH-110 / SPC100 (compatible with all Windows OS)
Power Supply 95–240 V AC, 50 Hz, 1000 mA
Weight 30 kg
Application Area
Category Measurable Features
Solder Paste Thickness, Area, Volume, Gap, Angle, Length, Width, Arc
Irregular Geometric Sizes Any non-standard shape within 10 mm height
PCB & Printing Ink Circuit line width, Pad height, Dimensional measurement
Electronic Components Horizontal coplanarity
Image Processing Image capture, Video processing, Documentary management
SPC Statistical Analysis CPK, Cp, and print output with full reporting
Standard Configuration (Included in Package)
Item Quantity
SH-110-2D Main Unit 1
Software Package (CD/USB) 1
Video Capture Card 1
Transmission Line 1
Video Signal Line 1
Software Encryptor (Dongle) 1
Corrective Gauges (Calibration Tool) 1
Power Cable 1
Operating Manual 1
Operating Principle (Technical Explanation for Engineers)

The non-contact thickness gauge emits a very fine laser beam at a fixed incident angle onto the measurement target. Because the target (solder paste) and its surrounding substrate (PCB surface) differ in height, the reflected sensor receives multiple laser differences.

Based on the observed data, the analysis program—using trigonometric functions—rapidly calculates and outputs precise information about the measurement target, including height, width, area, and derived volume.

Καλή τιμή  σε απευθείας σύνδεση

λεπτομέρειες για τα προϊόντα

Σπίτι > προϊόντα >
Μηχανή SMT SPI
>
High Precision 2D Laser Solder Paste Thicknes Inspection Machine

High Precision 2D Laser Solder Paste Thicknes Inspection Machine

Ονομασία μάρκας: HXT
Αριθμός μοντέλου: SH-110-2D
MOQ: 1
τιμή: 1200
Πληροφορίες συσκευασίας: Κιβώτιο Wodden
Όροι πληρωμής: T/T
Πληροφορίες λεπτομέρειας
Τόπος καταγωγής:
Κίνα
Μάρκα:
HXT
Πιστοποίηση:
CE
Αριθμό μοντέλου:
SH-110-2D
Ακρίβεια μέτρησης:
±0,001 mm (±1 µm)
Επαναλαμβανόμενη ακρίβεια:
±0,002 mm (±2 µm)
Διαστάσεις βάσης:
320 mm * 500 mm * 360 mm
Οπτική Μεγέθυνση:
25* – 110* (ρυθμιζόμενο σε 5 βήματα)
Ανάλυση εικόνας:
600 * 480 pixel
βάρος:
30 κιλά
Ποσότητα παραγγελίας min:
1
Τιμή:
1200
Συσκευασία λεπτομέρειες:
Κιβώτιο Wodden
Χρόνος παράδοσης:
30 ημέρες
Όροι πληρωμής:
T/T
Δυνατότητα προσφοράς:
1000 το μήνα
Περιγραφή προϊόντων
2D Solder Paste Thickness Inspection Machine
High Precision 2D Laser Solder Paste Thicknes Inspection Machine 0
Brief Introduction (Optimized for Buyers)

As Surface Mount Technology (SMT) advances, electronic components become increasingly smaller, packaging density becomes denser, and solder joints shrink correspondingly. Nearly 70% of PCB assembly defects are caused by improper solder paste printing.

The SH-110-2D Solder Paste Thickness Inspection Machine is designed to solve this problem. It effectively identifies potential defective solder deposits before component placement, provides accurate SPC control data (CPK, Cp), and significantly reduces defect rates.

In today's competitive electronic manufacturing environment, lower defect rates translate directly into higher profits. Strict process control requires factories to demonstrate their capability in managing solder paste printing during production. This machine provides that proof.

Beyond Solder Paste: The SH-110-2D can also be used in other production fields. Any geometric information of objects and components within 10 mm height can be precisely and non-contact measured.

Technological Parameters
Parameter Specification
Measurement Principle Non-contact laser triangulation
Measurement Accuracy ±0.001 mm (±1 µm)
Repeat Measurement Accuracy ±0.002 mm (±2 µm)
Base Dimensions (L*W*H) 320 mm * 500 mm * 360 mm
Platform Type Fixed marble platform (vibration-dampening)
Image System VGA high-definition camera
Optical Magnification 25* – 110* (5-step adjustable)
Measurement Light Source High-definition red laser
Illumination Adjustable annular LED (PC-controlled brightness)
Image Resolution 600 * 480 pixels
Software SH-110 / SPC100 (compatible with all Windows OS)
Power Supply 95–240 V AC, 50 Hz, 1000 mA
Weight 30 kg
Application Area
Category Measurable Features
Solder Paste Thickness, Area, Volume, Gap, Angle, Length, Width, Arc
Irregular Geometric Sizes Any non-standard shape within 10 mm height
PCB & Printing Ink Circuit line width, Pad height, Dimensional measurement
Electronic Components Horizontal coplanarity
Image Processing Image capture, Video processing, Documentary management
SPC Statistical Analysis CPK, Cp, and print output with full reporting
Standard Configuration (Included in Package)
Item Quantity
SH-110-2D Main Unit 1
Software Package (CD/USB) 1
Video Capture Card 1
Transmission Line 1
Video Signal Line 1
Software Encryptor (Dongle) 1
Corrective Gauges (Calibration Tool) 1
Power Cable 1
Operating Manual 1
Operating Principle (Technical Explanation for Engineers)

The non-contact thickness gauge emits a very fine laser beam at a fixed incident angle onto the measurement target. Because the target (solder paste) and its surrounding substrate (PCB surface) differ in height, the reflected sensor receives multiple laser differences.

Based on the observed data, the analysis program—using trigonometric functions—rapidly calculates and outputs precise information about the measurement target, including height, width, area, and derived volume.